Compartilhar:
em 21/01/2025
O TSMC recebe subsídio de US $ 1,5 bilhão do governo dos EUA e entregou o primeiro lote de bolachas
TSMC's Chief Financial Officer, Huang Renzhao, recently revealed in an interview with American media that the company received $1.5 billion in subsidies from the US government in the fourth quarter of 2024. Huang Renzhao stated that it is expected that under the Trump administration, the subsidyOs fundos prometidos pelo governo dos EUA serão gradualmente desembolsados.

TSMC's plan to invest $65 billion to establish three wafer fabs in Arizona, USA, was officially signed on November 15, 2024, before the Biden administration stepped down. The US Department of Commerce will provide TSMC Arizona, a subsidiary of TSMC located in Arizona, USA, with up to $6.6 billion in direct funding and $5 billion in loans under the Chip and Science Act.
TSMC announced its first investment in Arizona in May 2020, followed by the construction of a second wafer fab in 2023, increasing the investment scale to $40 billion.In April 2024, TSMC announced that it would build a third wafer fab on top of its plans to build two in Phoenix, Arizona, increasing the total investment from $40 billion to $65 billion.Isso criará mais de 25000 trabalhos diretos de construção e fabricação, bem como milhares de empregos indiretos.
According to the plan, these three wafer fabs will include the first phase of the 4nm wafer fab, which will be completed in April 2024 and begin mass production for customers using the 4nm process in September.O primeiro lote de bolachas será entregue aos clientes em dezembro, e a produção em massa será adiada para a primeira metade de 2025;The second phase 3nm wafer fab, originally scheduled to start mass production in 2026, has been postponed to 2028. After the completion of the two wafer fabs, the total annual output will exceed 600000 wafers, with an estimated market value of over 40 billion USdólares quando convertidos em produtos finais.As Fabs de wafer de fase três recém-adicionadas produzirão tecnologias de processo de 2Nm ou mais avançadas e devem ser produzidas em massa no final da década de 2020 (2029-2030).